Piezoelectric ceramic chips are materials that can convert mechanical energy into electrical energy, based on the piezoelectric effect. When piezoelectric ceramic chips are subjected to external forces, charges are generated on their surface, resulting in voltage generation. On the contrary, when a voltage is applied to the surface of a piezoelectric ceramic chip, mechanical deformation occurs inside. This characteristic makes piezoelectric ceramic chips widely used in fields such as vibration sensors, ultrasonic generators, and electronic instruments.
The manufacturing process of piezoelectric ceramic chips mainly includes steps such as batching, forming, sintering, and polarization.
1. Ingredients: Select appropriate chemical raw materials as needed, such as barium titanate, lead zirconate, etc., and mix them in a certain proportion.
2. Forming: Put the mixed raw materials into the mold and make a certain shape of the embryo through pressing or extrusion.
3. Sintering: Sintering the embryo at high temperature to make it a dense ceramic material.
4. Polarization: Polarize the sintered ceramic to give it a piezoelectric effect.
Specification | Dimension (mm) |
Radial frequency (Khz) |
Capacitance (±12.5%) pF |
Dielectric dissipation factortanδ (%) |
Impedance (Ω) |
Electromechanical coupling coefficientKr | Mechanical quality factor (Qm) |
PLS-QXJP3030 | Φ30×3.0 | 66.7 | 2730 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP3530 | Φ35×3.0 | 63 | 3100 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP3865 | Φ38×6.5 | 59.9 | 1580 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP4530 | Φ45×3.0 | 50 | 5100 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP4535 | Φ45×3.5 | 50 | 4700 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP5030 | Φ50×3.0 | 46 | 5800 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP5035 | Φ50×3.5 | 46 | 6300 | ≤0.3 | ≤15 | ≥0.55 | 500 |
PLS-QXJP5050 | Φ50×5.0 | 46 | 4150 | ≤0.3 | ≤15 | ≥0.55 | 500 |