In the manufacturing of ultrasonic electronic circuit boards, special technologies and means are also required. Například, in the manufacturing of circuit boards, high-precision processing and manufacturing techniques need to be adopted to ensure the accuracy and quality of the circuit board; In the layout of components, it is necessary to consider factors such as the arrangement, direction, and interrelationships of the components to avoid electromagnetic interference and signal interference; During the welding process, special welding techniques and processes are required to ensure welding quality and reliability of the circuit board.
Model | Moc(W) | Frekvence (kiloherth) | Operating voltage | Maximum output current |
PU-XLB50W | 50 | 25kiloherth,28kiloherth,33kiloherth,40kiloherth | AC110V/220V | 0.33A |
PU-XLB100W | 100 | 25kiloherth,28kiloherth,33kiloherth,40kiloherth | AC110V/220V | 0.45A |
PU-XLB150W | 150 | 25kiloherth,28kiloherth,33kiloherth,40kiloherth | AC110V/220V | 0.65A |