In the manufacturing of ultrasonic electronic circuit boards, special technologies and means are also required. 例如, in the manufacturing of circuit boards, high-precision processing and manufacturing techniques need to be adopted to ensure the accuracy and quality of the circuit board; In the layout of components, it is necessary to consider factors such as the arrangement, direction, and interrelationships of the components to avoid electromagnetic interference and signal interference; During the welding process, special welding techniques and processes are required to ensure welding quality and reliability of the circuit board.
型 | 权力(W) | 频率 (千 赫) | Operating voltage | Maximum output current |
PU-XLB50W | 50 | 25千 赫,28千 赫,33千 赫,40千 赫 | AC110V/220V | 0.33一个 |
PU-XLB100W | 100 | 25千 赫,28千 赫,33千 赫,40千 赫 | AC110V/220V | 0.45一个 |
PU-XLB150W | 150 | 25千 赫,28千 赫,33千 赫,40千 赫 | AC110V/220V | 0.65一个 |